AC coupled interconnect for dense 3-D ICs
Jian Xu,, Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., Franzon, P.D.Volume:
51
Language:
english
Journal:
IEEE Transactions on Nuclear Science
DOI:
10.1109/tns.2004.834712
Date:
October, 2004
File:
PDF, 258 KB
english, 2004