IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1996 / Dec. Vol. 19; Iss. 4
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A closed form solution of junction to substrate thermal resistance in semiconductor chips
Masana, F.N.Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.554935
Date:
January, 1996
File:
PDF, 675 KB
english, 1996