Prediction of gap in QFP with unattached heat spreader

IEEE Transactions on Components and Packaging Technologies 2005 / 03 Vol. 28; Iss. 1

Prediction of gap in QFP with unattached heat spreader

Yi-Shao Lai,, Yi-Hsien Lin,, Jenq-Dah Wu,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2004.843170
Date:
March, 2005
File:
PDF, 734 KB
english, 2005
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