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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Orientation relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint
Shang, Pan-Ju, Liu, Zhi-Quan, Li, Douxing, Shang, Jian-KuYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582454
File:
PDF, 4.69 MB
english, 2010