![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
Sung-Mao Wu,, Sheng-Wei Guan,, Chun-Ting Kuo,, Bo-Huei Yu,, Chuan- Hau Liu,, Xian-Neng Chiou,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582366
File:
PDF, 777 KB
english, 2010