Crack propagation behavior by thermal fatigue around...

Fusion Engineering and Design 2005 Vol. 75-79; Iss. none

Crack propagation behavior by thermal fatigue around DSCu/SS316 HIP bonded interface

T. Oyama, A. Yamamoto, K. Mohri, M. Saito
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Volume:
75-79
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.fusengdes.2005.06.199
File:
PDF, 324 KB
english, 2005
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