Design and Fabrication of FlexConnects: A Cost-Effective...

IEEE Transactions on Components and Packaging Technologies 2008 / 12 Vol. 31; Iss. 4

Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects

Kacker, Karan, Sitaraman, Suresh K.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2001199
Date:
December, 2008
File:
PDF, 1.19 MB
english, 2008
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