Mapping of mechanical, thermomechanical and wire-bond...

IEEE Transactions on Components and Packaging Technologies 2001 / 3 Vol. 24; Iss. 1

Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam X-ray topography

McNally, P.J., Rantamaki, R., Tuomi, T., Danilewsky, A.N., Lowney, D., Curley, J.W., Herbert, P.A.F.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.910805
Date:
March, 2001
File:
PDF, 149 KB
english, 2001
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