[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - A novel X-ray diffraction technique for analysis of die stress inside fully encapsulated packaged chips
Wong, Chiu Soon, Bennett, Nick, Allen, David, Danilewsky, Andreas, McNally, PatrickYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542095
File:
PDF, 1.46 MB
english, 2012