[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Thermal management of a stacked-die package in a handheld electronic device using passive solutions
Sung-won Moon,, Prstic, S., Chia-pin Chiu,Year:
2006
Language:
english
DOI:
10.1109/itherm.2006.1645428
File:
PDF, 524 KB
english, 2006