[IEEE 2013 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2013.12.9-2013.12.11)] 2013 IEEE International Electron Devices Meeting - Monolithic 3D chip integrated with 500ns NVM, 3ps logic circuits and SRAM
Shen, Chang-Hong, Shieh, Jia-Min, Wu, Tsung-Ta, Huang, Wen-Hsien, Yang, Chih-Chao, Wan, Chih-Jen, Lin, Chein-Din, Wang, Hsing-Hsiang, Chen, Bo-Yuan, Huang, Guo-Wei, Lien, Yu-Chung, Wong, Simon, Wang,Year:
2013
Language:
english
DOI:
10.1109/iedm.2013.6724593
File:
PDF, 1.32 MB
english, 2013