Heat transfer in cooling systems of microelectronic...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1996 / 6 Vol. 19; Iss. 2

Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

Kabov, O.A.
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Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.506099
Date:
June, 1996
File:
PDF, 558 KB
english, 1996
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