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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - An evaluation of the HotOzone/sup TM/ process: a new post etch resist and residue removal process
Shawming Ma,, Parker, R., Kavari, R., Leal, I., Boyers, D.G., Cremer, J.T.Year:
2000
Language:
english
DOI:
10.1109/iitc.2000.854277
File:
PDF, 450 KB
english, 2000