[IEEE Comput. Soc. Press 1997 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA (4-5 Feb. 1997)] Proceedings 1997 IEEE Multi-Chip Module Conference - Flexible manufacturing of multichip modules for flip chip ICs
Yee, I., Miracky, R., Reed, J., Lunceford, B., Minchuan Wang,, Cobb, D., Caldwell, G.Year:
1997
Language:
english
DOI:
10.1109/mcmc.1997.569357
File:
PDF, 427 KB
english, 1997