A Novel Silicon-Based LED Packaging Module With an...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 5 Vol. 4; Iss. 5

A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor

Chang, Shengwei, Tsou, Chingfu
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2305169
Date:
May, 2014
File:
PDF, 1.32 MB
english, 2014
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