Strength of Gold-Plated Copper Leads on Thin Film Circuits...

IEEE Transactions on Parts Hybrids and Packaging 1975 / 09 Vol. 11; Iss. 3

Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging

Hall, P., Panousis, N., Menzel, P.
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Volume:
11
Language:
english
Journal:
IEEE Transactions on Parts, Hybrids, and Packaging
DOI:
10.1109/tphp.1975.1135064
Date:
September, 1975
File:
PDF, 848 KB
english, 1975
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