A new four-level metal interconnect system tailored to an...

A new four-level metal interconnect system tailored to an advanced 0.5-μm BiCMOS technology

Wall, R.N., Olewine, M.C., Augur, R., DiGregorio, J., Colovos, G.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
11
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/66.728560
Date:
January, 1998
File:
PDF, 375 KB
english, 1998
Conversion to is in progress
Conversion to is failed