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A new four-level metal interconnect system tailored to an advanced 0.5-μm BiCMOS technology
Wall, R.N., Olewine, M.C., Augur, R., DiGregorio, J., Colovos, G.Volume:
11
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/66.728560
Date:
January, 1998
File:
PDF, 375 KB
english, 1998