[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Microstructure and Deformability of Sn-Zn-Bi Alloys
Zhou, Jian, Li, Peipei, Xiao, Yingying, Fu, XiaoqingYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359837
File:
PDF, 5.32 MB
english, 2006