Reliability and Failure Analysis of Sn-Ag-Cu Solder...

IEEE Transactions on Device and Materials Reliability 2004 / 03 Vol. 4; Iss. 1

Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections for PSGA Packages on Ni/Au Surface Finish

Ratchev, P., Vandevelde, B., DeWolf, I.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2003.822341
Date:
March, 2004
File:
PDF, 567 KB
english, 2004
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