[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Design, Process Development and Prototyping of 3D Packaging with Multi-Stacked Flip Chips and Peripheral Through Silicon Via Interconnection
Hon, Ronald, Lee, S. W. RickyYear:
2006
Language:
english
DOI:
10.1109/iemt.2006.4456436
File:
PDF, 4.99 MB
english, 2006