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[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Warpage behavior in 2.5D package using Si-interposer
Hara, Koji, Murayama, Kei, Aizawa, Mitsuhiro, Higashi, MitsutoshiYear:
2013
Language:
english
DOI:
10.1109/icsj.2013.6756076
File:
PDF, 514 KB
english, 2013