[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Using state-space models for accurate computations of transient thermal behavior of electronic packages
Shankaran, Gokul V., Dogruoz, M. Baris, Magargle, RyanYear:
2014
Language:
english
DOI:
10.1109/itherm.2014.6892389
File:
PDF, 819 KB
english, 2014