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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Cu wire bonding for fine pitch 65nm silicon integrated circuits
Low, Qwai, Osenbach, John, Yang, YongSeok, Seong, KyeongSool, Na, SeokHoYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490847
File:
PDF, 919 KB
english, 2010