[IEEE Comput. Soc 1998 IEEE Symposium on IC/Package Design Integration - Santa Cruz, CA, USA (2-3 Feb. 1998)] Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211) - Modeling requirements and techniques for plastic packages used in RFICs
Rafie-Hibner, W., Brogan, T.Year:
1998
Language:
english
DOI:
10.1109/ipdi.1998.663638
File:
PDF, 55 KB
english, 1998