Artificial neural networks and statistical modeling for...

Artificial neural networks and statistical modeling for electronic stress prediction using thermal profiling

Sheng-Jen Hsieh,
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2004.830517
Date:
January, 2004
File:
PDF, 750 KB
english, 2004
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