[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - The characteristics of ultrasonic vibration transmission and coupling in bonding technology
Lu Junhui,, Tan Jianping,, Han Lei,, Zhong Jue,Year:
2004
Language:
english
DOI:
10.1109/hpd.2004.1346718
File:
PDF, 440 KB
english, 2004