[IEEE 2010 5th International Microsystems, Packaging,...

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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The investigation of defect screening methodology using mechanical stress test for Pb-free module product

Chang, Graver Chuan-Chun, Yu, Chi-Ko, Shao, Tina, Chen, Cherie, Lee, Jeffrey, Bansal, Anurag, Liu, Kuo-Chuan
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Year:
2010
Language:
english
DOI:
10.1109/impact.2010.5699596
File:
PDF, 194 KB
english, 2010
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