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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Failure analysis of lead-free solder joints for flip chip on board
Fu-Ming Tzu,, Long-Sun Chao,, Jung-Hua Chou,Year:
2007
Language:
english
DOI:
10.1109/impact.2007.4433625
File:
PDF, 184 KB
english, 2007