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[IEEE Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (18-19 Oct. 1999)] Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) - Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls
Seungyoung Ahn,, Woonghwan Ryu,, Myung-Jin Yim,, Junho Lee,, Young-Doo Jeon,, Woopoung Kim,, Kyung-Wook Paik,, Joungho Kim,Year:
1999
Language:
english
DOI:
10.1109/iemt.1999.804854
File:
PDF, 382 KB
english, 1999