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[IEEE 2009 IEEE International Reliability Physics Symposium (IRPS) - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Package design and material impact on board level reliability of fine pitch packages
Syed, AhmerYear:
2009
Language:
english
DOI:
10.1109/irps.2009.5173242
File:
PDF, 87 KB
english, 2009