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[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Wideband electrical characterization and modeling of plastic packaging materials
Riad, S.M., Wansheng Su,, Salama, I., Elshabini, A., Rachlin, M.Year:
1998
Language:
english
DOI:
10.1109/isapm.1998.664447
File:
PDF, 97 KB
english, 1998