Correlation of flip chip underfill process parameters and...

IEEE Transactions on Electronics Packaging Manufacturing 1999 / 01 Vol. 22; Iss. 1

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

Palaniappan, P., Baldwin, D.F., Selman, P.J., Jaili Wu,, Wong, C.P.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.755089
Date:
January, 1999
File:
PDF, 1.24 MB
english, 1999
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