[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Impact of different flip-chip bump materials on bump temperature rise and package reliability
Chau, D.S., Gupta, A., Chia-Pin Chiu,, Prstic, S., Reynolds, S.Year:
2005
Language:
english
DOI:
10.1109/isapm.2005.1432054
File:
PDF, 1.82 MB
english, 2005