1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds
Vandamme, L.K.J., Perichaud, M.G., Noguera, E., Danto, Y., Behner, U.Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.796549
Date:
January, 1999
File:
PDF, 232 KB
english, 1999