[IEEE Proceedings of the IEEE 2004 International...

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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - The effect of FSG stability at high temperature on stress-induced voiding in Cu dual-damascene interconnects

Hyeok-Sang Oh,, JuHyuk Chung,, Jung-Woo Lee,, Ki-Ho Kang,, Dea-Gun Park,, SangRok Hah,, In-Soo Cho,, Kwang-Myeon Park,
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Year:
2004
Language:
english
DOI:
10.1109/iitc.2004.1345671
File:
PDF, 232 KB
english, 2004
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