[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Modelling complex via hole structures
Laermans, E., De Geest, J., De Zutter, D., Olyslager, F., Sercu, S., Morlion, D.Year:
2001
Language:
english
DOI:
10.1109/epep.2001.967633
File:
PDF, 345 KB
english, 2001