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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Oxidation properties of Sn-Cu-Ni solders with minor alloying additions
Chang-Chien, Yu-Chien, Song, Jenn-Ming, Huang, Bo-Chang, Chen, Wei-Ting, Shie, Chi-Rung, Hsu, Chuang-YaoYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699516
File:
PDF, 217 KB
english, 2010