[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures
Xiao, A., Schlottig, G., Pape, H., Wunderle, B., van der Sluis, O., Jansen, K. M. B., Ernst, L. J.Year:
2009
Language:
english
DOI:
10.1109/icept.2009.5270607
File:
PDF, 795 KB
english, 2009