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[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Investigation of ultrasonic platinum and palladium wire bonding as interconnection technology for high-temperature SiC-MEMS
Zeiser, Roderich, Wagner, Philipp, Wilde, JuergenYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542125
File:
PDF, 13.80 MB
english, 2012