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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Thermal cycling reliability assessment and enhancement of embedded wafer level LGA packages for power applications
Ma, Yiyi, Goh, Kim-Yong, Zhang, Xueren, Jin, YonggangYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745792
File:
PDF, 1.49 MB
english, 2013