[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Thermal numerical simulation for advanced package development
Gao, Guohua, Wang, HongHui, Yang, GuoJi, Zhu, HaiQingYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270755
File:
PDF, 1.32 MB
english, 2009