[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Failure mechanism and mitigation of PCB pad cratering
Xie, Dongji, Geiger, David, Shangguan, Dongkai, Cai, Charles, Wu, Boyi, Hu, Billy, Liu, Hans, Martin, IvanYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490930
File:
PDF, 1.25 MB
english, 2010