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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production
Fang, Runiu, Miao, Min, Sun, Xin, Zhu, Yunhui, Wang, Guanjiang, Xu, Yichao, Sun, Minggang, Jin, YufengYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897354
File:
PDF, 1.00 MB
english, 2014