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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Effect of Support Tape on Package Delamination and Tape Adhesive Residue Study in Power QFN Assembly
Pang, Xingshou, Xu, Xuesong, Yao, JinzhongYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469693
File:
PDF, 350 KB
english, 2007