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Integration Challenges of Nanoporous Low Dielectric Constant Materials
Taek-Soo Kim,, Dauskardt, R.H.Volume:
9
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2009.2033670
Date:
December, 2009
File:
PDF, 1.02 MB
english, 2009