Integration Challenges of Nanoporous Low Dielectric...

IEEE Transactions on Device and Materials Reliability 2009 / 12 Vol. 9; Iss. 4

Integration Challenges of Nanoporous Low Dielectric Constant Materials

Taek-Soo Kim,, Dauskardt, R.H.
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Volume:
9
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2009.2033670
Date:
December, 2009
File:
PDF, 1.02 MB
english, 2009
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