[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigating micro-alloyed solders with thermal shock tests
Garami, Tamas, Krammer, OliverYear:
2012
Language:
english
DOI:
10.1109/siitme.2012.6384361
File:
PDF, 694 KB
english, 2012