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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - A concise multiple scattering method for via array analysis in a circular plate pair
Zhang, Yaojiang, Fan, Jun, Chada, Arun Reddy, Drewniak, James L.Year:
2008
Language:
english
DOI:
10.1109/edaps.2008.4736020
File:
PDF, 794 KB
english, 2008