[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - A ceramic pin grid array package with 370 I/O leads
Ji Chunfeng,, Fu Hualiang,, Zheng Hongyu,, Liu Qiaoming,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1298704
File:
PDF, 168 KB
english, 2003