Real-Time Quality Evaluation of Wire Bonding Using Input Impedance
Ling, Shih-Fu, Zhang, Dong, Yi, Sung, Foo, Say WeeVolume:
29
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2006.887400
Date:
October, 2006
File:
PDF, 214 KB
english, 2006