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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Comparison the reliability of small plated-through hole with different diameters under thermal stress
Wu, Jing-Han, Meng-Chieh, Liao, Tzeng-Cherng, Luo, Te-Chun, HuangYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117233
File:
PDF, 790 KB
english, 2011